Equipment and Capabilities

Soldering

• 40+ lead and lead-free soldering stations
• Two lead and lead-free soldering pots
• ISO certified repair documentation and work instructions

Ball Grid Array Repair

• Three SRT Model Summit 1100LX BGA Rework Stations

• Board size to 24" x 36"
• Auto profile fro rapid process development and reduced variation
• High resolution vision system for accurate component alignment
• Fully-automated operations for improved repeatability
• BGA, uBGA, CSP, QFP, Flip-Chip, CCGA
• BGA reballing using lead and nonleaded spheres

X-Ray Inspection Services

The PCB group now offers a variety of X-Ray inspection services. Our in-house equipment offers 240x magnification, which supports analysis of very fine mechanical connections including micro-BGA.

Equipment

• Nicolet Model NXR-1410HR cabinet style, real-time X-Ray imaging system

Capabilities

• 90k V end-window 8 micron X-Ray source
• 240x magnification
• High resolution digital image capture

Board Baking Service

The PCB group provides an inert gas oven for baking or moisture drying needs. This capability can be used alone and/or in conjunction with repair processes involving BGA repair.

Equipment

Blue M electronic model 1406 inert gas oven

Capabilities

• Temperature range from 15 degrees C above ambient to 350 degrees C
• Interior dimensions 48"x24"x36"

Features

• 10 segments programmable controller
• Segments programmable for up to 100 hours each
• Variable setting OTC (over temperature controller) to prevent product damage

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